2026.08.12
Exhibition information|
|
Welcome to SEMICON Taiwan 2026 Advanced Equipment.Taiwan-Based Technical Support Semiconductor|Photovoltaics|SiC Wafer Process Solutions |
We represent leading global equipment and software brands, supported by our Taiwan-based technical team.
Our comprehensive services include requirements assessment, solution consulting,
equipment and software implementation, training, maintenance, and troubleshooting.
■ Exhibition Highlights ▸On-site demonstrations
|
Wafer Measurement & Surface Inspection |
|||
|
◆ E+H Metrology
|
Non-contact Wafer Thickness and Warp Measurement Systems: Manual & Automated Integrated Solutions
|
||
|
◆ DIP-View
|
High-resolution, high-speed wafer surface topography and roughness measurement.
|
||
|
◆ Hologenix
|
Optical inspection equipment for wafer surface defects, edge inspection, and lattice slip.
|
||
|
SECS/GEM Integration & Factory Automation |
|||
|
◆ eInnoSys
|
SECS/GEM equipment integration, factory automation, and AI/ML solutions.
|
||
| Wafer Grinding & Polishing | |||
|
◆ G&N |
High-Precision Grinding & Polishing Equipment for SiC, Metals, and Ceramics | ||
■ Product Info Session
A Product Info Session will be held at the Chunson booth, featuring core technologies, key applications, and case studies.
|
Time / Date |
9/2 (Wed) |
9/3 (Thu) |
9/4 (Fri) |
|
11:00 - 11:30 |
eInnoSys |
G&N / Hologenix |
|
|
14:00 - 14:30 |
E+H Metrology |
DIP-View |
■ Exhibition Information
We look forward to meeting you at SEMICON Taiwan 2026!
September 2, 2026 (Wed) – September 4, 2026 (Fri), 10:00–17:00 (Last day until 16:00)
Taipei Nangang Exhibition Center, Hall 1, 4F | Booth N0362 (map)

