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2025.08.11

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Wafer Surface Inspection — Hologenix Magic Mirror™ Precisely Reveals Micro Defects

Hologenix Magic Mirror™ adopts the ancient “Magic Mirror” (Makyoh) concept,

using reflected light beams to transform wafer surface defects into clear, visible images.

It is applicable for surface defect inspection at various process stages, including polishing, oxidation, diffusion, CVD, CMP, SOI, and post-implantation annealing (RTP).

 

Exceptional Sensitivity – Driving Sub-Micron Detection Capability

• Wide detection range: height differences from 0.4 µm (over a 10 mm lateral distance) to 0.05 µm (over a 0.5 mm lateral distance) with high precision

• Clearly identifies micro defects and deformations caused by cutting, grinding, polishing, bonding, and other processes,such as dimples, mounds, slip lines, and scratches.
 

Fully Automated Precision Inspection – Achieving Both Efficiency and Quality

• Supports 200 mm and 300 mm wafers, with automated detection and sorting, achieving a throughput of up to 150 wafers per hour
• Built-in Windows-based ADDS automatic defect classification system with fully adjustable sensitivity, brightness, and workflow
• Integrated optical module control, defect classification, and FOUP/Cassette automated handling, with SECS II–GEM communication interface support

 

   

Hologenix Magic Mirror™ injects innovation into wafer manufacturing, whether for enhancing yield control, reducing scrap risk, or accelerating process inspection.

Hologenix Magic Mirror™ delivers precise solutions — a key tool for upgrading to advanced wafer processes.